Hexagonal boron nitride powder

Hexagonal boron nitride powder

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Hexagonal boron nitride (h-BN) is an advanced ceramic material that exhibits a lamellar morphology at the microscale and a hexagonal crystal structure. H-BN possesses unique and excellent physicochemical properties, including excellent thermal conductivity, electrical insulation, chemical corrosion resistance, and oxidation resistance. Its temperature resistance reaches up to 1000°C in air, and can even reach up to 2000°C in inert gas and vacuum conditions. After high-temperature reactive sintering at 2000°C, h-BN exhibits stable chemical and physical properties, along with superior thermal conductivity (with a thermal conductivity coefficient of approximately 250-300W/mk for single crystals). Currently, our company produces lamellar crystalline powders ranging from 500 nanometers to 20 micrometers, as well as nano-sized spherical boron nitride.


Hexagonal boron nitride is highly favored by the electronics industry due to its unique combination of high thermal conductivity and electrical insulation properties. Both domestic and international electronics manufacturers have conducted extensive research on its large-scale applications in thermal fillers, semiconductor packaging fillers, LED heat dissipation packaging, and more. Boron nitride also excels in traditional metal smelting, casting, special lubricants, and the glass industry.


Hexagonal boron nitride is an advanced ceramic material with a hexagonal crystal structure and a flaky morphology at the microscopic level. This material combines excellent thermal conductivity (thermal conductivity of single crystal is 250-300W/m·K), electrical insulation, chemical corrosion resistance, and oxidation resistance. It can withstand high temperatures of 1000℃ in air and even 2600℃ in an inert atmosphere or vacuum environment. The boron nitride products prepared by our company using a high-temperature reaction sintering process at 1900℃ exhibit stable chemical and physical properties. Our existing products include flaky crystalline powders ranging from 2nm to 100nm.


With its unique thermal conductivity and insulation properties, hexagonal boron nitride finds widespread application in the electronics industry, including as a thermal conductive filler, in semiconductor packaging, and for LED heat dissipation. Additionally, it exhibits excellent performance in traditional industrial fields such as metal smelting, casting, special lubricants, and glass manufacturing.

model

purity%

granularity

Boron oxide%

Total Oxygen%

carbon%

specific surface area(㎡/g)

F-BN100

>98.5

2-75μm

<0.8

<1.0

<0.12

2-32

F-BN200

>99.0

2-75μm

<0.4

<0.7

<0.1

2-32

F-BN300

>99.3

2-75μm

<0.2

<0.25

<0.05

2-32

F-BN400

>99.6

2-75μm

<0.08

<0.18

<0.03

2-32

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