Hexagonal boron nitride (h-BN) is an advanced ceramic material that exhibits a lamellar morphology at the microscale and a hexagonal crystal structure. H-BN possesses unique and excellent physicochemical properties, including excellent thermal conductivity, electrical insulation, chemical corrosion resistance, and oxidation resistance. Its temperature resistance reaches up to 1000°C in air, and can even reach up to 2000°C in inert gas and vacuum states. After high-temperature reactive sintering at 2000°C, h-BN exhibits stable chemical and physical properties and excellent thermal conductivity (with a single-crystal thermal conductivity of approximately 250-300W/mk). Currently, our company produces lamellar crystalline powders ranging from 500 nanometers to 20 micrometers, as well as nano-sized spherical h-BN.

Hexagonal boron nitride (h-BN) is highly favored by the electronics industry due to its unique combination of high thermal conductivity and electrical insulation properties. Both domestic and international electronics manufacturers have conducted extensive research on its large-scale applications in thermal fillers, semiconductor packaging fillers, LED heat dissipation packaging, and more. In addition, boron nitride has demonstrated excellent performance in traditional metal smelting, casting, special lubricants, and the glass industry.

Hexagonal boron nitride is an advanced ceramic material with a hexagonal crystal structure, exhibiting a lamellar morphology at the microscopic level. This material combines excellent thermal conductivity (with a single crystal thermal conductivity of 250-300W/m·K), electrical insulation, chemical corrosion resistance, and oxidation resistance. It can withstand high temperatures of 1000℃ in air and even 2600℃ in an inert atmosphere or vacuum environment. Our company utilizes a high-temperature reactive sintering process at 1900℃ to prepare boron nitride products with stable chemical and physical properties. Our current products include lamellar crystalline powders ranging from 2nm to 100nm.

With its unique thermal conductivity and insulation properties, hexagonal boron nitride finds widespread application in the electronics industry, including as a thermal filler, semiconductor packaging material, and LED heat dissipation material. Additionally, it exhibits excellent performance in traditional industrial fields such as metal smelting, casting, special lubricants, and glass manufacturing.