Fuweike adopts the internationally advanced vacuum hot-press sintering process to produce hot-pressed hexagonal boron nitride ceramic products. Its products exhibit excellent mechanical, chemical, electrical, and thermal properties, meeting the needs of various high-performance industrial applications. The company can provide boron nitride ceramic products with high purity or added specific binders according to different industry requirements, and offer complete solutions supporting various application scenarios and customized profile needs.
Application scenario
High-purity boron nitride crucible - suitable for molten metal processing.
Sintering crucible and sintering plate - used for sintering materials such as nitride phosphors, silicon nitride, and aluminum nitride.
Insulating components for high-temperature furnaces - including electrode insulating components and protective tubes.
Polycrystalline silicon ingot furnace components - providing boron nitride insulation parts.
Boron Nitride Ceramics - Properties
BNH
purity
>99.5 （%）
density
1.96 （g/cm3）
hardness
4 （kg/mm2）
bending strength
22 （Map）
coefficient of thermal expansion
-1-1.2（10-6/K）
thermal conductivity
50-70（w/mk）
maximum temperature
850-2000（℃）
resistivity
>1014（Ω.cm）
Fuweike Hexagonal Boron Nitride (h-BN) Ceramic Core Performance Parameter Table Note: Except for special notes, all values in the table are typical values for regular industrial-grade high-purity products (BN≥99.6%)
Performance Category specific indicators unit Parameter Value Additional notes heat resistance Heat-resistant temperature in nitrogen/argon atmosphere Heat-resistant temperature in vacuum environment Heat-resistant temperature in oxygen atmosphere
It has no distinct melting point and decomposes by sublimation at 2700℃ under normal pressure Slow oxidation above 1000℃ in air produces B₂O₃
thermal properties Room temperature thermal conductivity (parallel to the lamellar direction) Room temperature thermal conductivity (in the vertical lamellar direction) Thermal conductivity at 1000℃ (perpendicular to c-axis) Thermal expansion coefficient (parallel to the lamellar direction, 20-1000℃) Thermal expansion coefficient (in the vertical lamellar direction, 20-1000℃) Thermal shock resistance
W/(m·K) W/(m·K) W/(m·K) ×10⁻⁶K⁻¹ ×10⁻⁶K⁻¹ ℃
60-120 20-40 约 27 1-2 4-6 800-1000
The core testing index for thermal shock resistance is ≥50W/(m・K) Above 600℃, its thermal conductivity is superior to that of most electrical insulators Overall typical value (2.0~4.0)×10⁻⁶K⁻¹ Maintain at 1000℃ for 20 minutes, then rapidly cool to room temperature. After hundreds of cycles, there is no cracking
Electrical properties Room temperature volume resistivity breakdown voltage Dielectric constant (1MHz) Dielectric loss (1MHz)
It remains at the same level at 1000℃ Excellent high-frequency insulation adaptability Conventional marking (2~8)×10⁻⁴
Physical properties density Mohs hardness Baidu Dimensional Accuracy
Lightweight advantage, approximately 55%-58% of 99% alumina ceramic Possessing self-lubricating properties of graphite-like layered structure High purity grade appearance characteristics Customizable high-precision machining
Mechanical Properties bending strength compressive strength
It has relatively high brittleness and an advantage in shear resistance
chemical composition BN purity (high purity grade) Total Oxygen Content B₂O₃ content moisture content
Low impurity content meets the requirements for electronic and optical grades Typical test values of industrial-grade finished products
Performance Category specific indicators unit Parameter Value Additional notes carbon content % ≤0.01 Basic powder performance (BN400 type) grain size D50 particle size tap density Specific surface area (SSA) oil absorption value
chemical stability Corrosion resistance Melt Compatibility
Resistant to most acids, alkalis, salts, and organic solvents It does not wet or react with most metal and glass high-temperature melts
It has no obvious reaction except with strong oxidizing acids (concentrated nitric acid, concentrated sulfuric acid) No impurity release, suitable for high-temperature packaging/flow guiding conditions
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